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Tháng Năm 21, 2024 The Art Of Semi 0 Comments

Chip Packaging has expanded from its conventional concept of providing protection and Input/Output for a semiconductor chip, to include a growing number of techniques for interconnecting numerous chips. In 2020, the worldwide advanced packaging industry was estimated to be worth $24 billion USD. This is a supporting case that protects silicon wafers, logics, and memory units from physical damage or corrosion during the final step of the semiconductor manufacturing process. In 2020, the Advanced Packaging Market was worth $24 billion. It is expected to grow at an 8% CAGR during the forecast period. The global wafer-level packaging market size is expected to reach more than $8 billion more by 2022, registering a CAGR of 21.5%. It makes it easier to attach the chip to the circuit board. Advanced packaging also includes the combination of many separate approaches, such as 2.5D, 3D-IC, fan-out-wafer-level packaging, and system-in-package. Consumers now want powerful, multi-functional electronic gadgets with exceptional performance and speed that are also tiny, portable, and inexpensive. This presents semiconductor businesses with difficult technological and production problems as they seek innovative ways to offer better performance and functionality in a compact, low-cost chip. Semiconductor industries offer a complete platform of wafer level technology solutions such as Fan-in Wafer Level Packaging, Fan-out Wafer Level Packaging, Through Silicon Via, Encapsulated Chip Package, and RFID. Advanced packaging is becoming more common as the cost and complexity of integrating everything onto a planar SoC grow more difficult and expensive with each subsequent node, but ensuring that these packaged devices perform properly and yield adequately isn’t so straightforward. Several factors are pulling more of the semiconductor industry toward advanced packaging.

Interconnects and cables in SoCs do not scale at the same rate as transistors.
The costs of designing and producing semiconductors are increasing with each additional node.
Resistance and capacitance, as well as heat and many sorts of noise, increase with each subsequent node.

By providing for high device density in a small footprint, Advanced Packaging technology has become essential for embedding more functionality into a variety of electronic devices, including cellular phones and automatic driving vehicles. Semiconductor packaging is an intermediate link in the electronics semiconductor manufacturing process, starting with wafer fabrication of numerous integrated circuits and continuing to the final enclosure for the finished product. Packaging assembly and device testing are two important manufacturing steps to develop an electronic product. The common goal of Advanced Packaging Technology is to protect the integrated circuits which are made up of many different interconnected components which allow it to communicate with the outer world. There exist many types of leadframes or substrates on which diced chips are bonded with adhesive and their electrical connections are made with fine bonding wires. To protect them, the bonding zone is covered by an Epoxy molding compound. In other words, it is a process of enclosing or encapsulating a semiconductor chip to protect it from the environment and provides for a reliable means of interconnection to the next level of integration. The package is referred to as the initial stage of packaging, followed by the circuit board and finally the final enclosure.

While some difficulties, such as designing a power supply network or floor-planning for heat or data flow, are straightforward, the integration of several chips can result in a wide range of interactions, some of which may only appear in one particular implementation. This is particularly troubling for inspection, metrology, and testing, as not all aspects of a unique design may be accessible. To perform correctly over that lifetime, a thorough understanding of all the individual elements, as well as interconnects and packaging materials, is required.

A semiconductor packaging is also used to protect the silicon chips from mechanical stresses such as vibrations, and the most important ESD (Electrostatic Discharge) during handling and mounting a chip on the substrate. The package must also meet the chips’ performance criteria, which include physical, mechanical, electrical, and thermal requirements. Finally, the package must meet quality and reliability requirements while also being a cost-effective solution for the final product. Wafer-Level Packaging, Bumping, Redistribution Layers, Fan-out, and Through-Silicon Vias are just a few of the techniques that allow next-generation advanced packaging. Many of the similar and complex applications in the industry, such as Multi-die integration, Memory bandwidth concerns, and even Chip Scaling, will be addressed by the new packages. However, there are several technical issues with the new, sophisticated IC packages. Cost is also a concern since advanced packaging is still prohibitively expensive. The following are critical factors of market growth:

The industry is growing due to the cost efficiency of advanced packaging technologies.
Market demand for automobiles is increasing.
Increased demand for consumer electronics items drives market expansion.
Increased need for gadget miniaturization.

There are various methods of Advanced Packaging which are listed below.