UMC đảm bảo đơn đặt hàng đóng gói tiên tiến lớn từ Qualcomm, thách thức sự thống trị của TSMC
Dec-16-2024 — United Microelectronics Corporation (UMC) (TW:2303) today announced a significant breakthrough in the advanced packaging market, securing a major contract from Qualcomm Incorporated (NASDAQ:QCOM) for high-performance computing (HPC) applications. This win marks a pivotal moment, challenging the long-held dominance of Taiwan Semiconductor Manufacturing Company (TSMC) in this critical sector.
Qualcomm will leverage UMC’s cutting-edge wafer-on-wafer (WoW) hybrid bonding technology for advanced packaging of its next-generation HPC chips. These chips, built using TSMC’s advanced process nodes and incorporating Qualcomm’s Oryon architecture, are slated for use in a range of high-growth markets, including AI PCs, automotive electronics, and the rapidly expanding AI server market. High-Bandwidth Memory (HBM) integration is also planned.
UMC’s WoW technology offers a significant advantage by reducing signal transmission distances between chips, leading to enhanced computational performance without requiring further advancements in wafer fabrication processes. This innovative approach represents a departure from traditional solder-ball connections, utilizing Package-on-Package (PoP) technology for superior efficiency.
“This strategic partnership with Qualcomm underscores UMC’s commitment to advanced packaging and our ability to deliver innovative solutions for the most demanding applications,” said UMC spokesperson. “We are actively building a robust ecosystem, collaborating with key partners including Faraday Technology, Silicon Integrated Systems, and Winbond, to solidify our position in this rapidly evolving market.”
Trial production of Qualcomm’s new HPC chips utilizing UMC’s advanced packaging is expected to commence in the second half of 2025, with mass production anticipated for 2026. This contract is expected to provide UMC with substantial growth momentum and reshape the competitive landscape of the advanced packaging industry.
