U.S.-Japan Foundry Cooperation Intensifies: A Threat to Samsung Electronics? – BusinessKorea
Rapidus, a nascent foundry (semiconductor contract manufacturing) company in Japan, is intensifying its collaboration with U.S. IBM to accelerate the production of 2-nanometer processes.
According to industry sources on June 13, IBM recently announced a joint development partnership with Rapidus for mass production technology of advanced packaging. Through this, Rapidus will receive high-performance semiconductor packaging technology from IBM.
Engineers from both companies will engage in joint development at IBM's U.S. research facilities for the research, development (R&D), and manufacturing of semiconductor packaging used in high-performance computer systems. The collaboration with IBM is expected to significantly accelerate Rapidus' plans for mass production of the 2-nanometer process and advance the timeline.
Previously, Rapidus aimed to test-produce 2-nanometer semiconductors by next year and start mass production in 2027. However, collaboration with IBM could further advance this timeline.
Rapidus is a foundry consortium created by investments from eight major Japanese corporations. It is currently constructing a foundry plant in Hokkaido, Japan.
U.S. Intel is also advancing its timeline, planning to start mass production of the 1.8-nanometer (18A) process later this year. This puts Intel ahead of Samsung Electronics in entering the next-generation process.
As Japanese and U.S. foundry companies accelerate their efforts, how Samsung Electronics, poised to start mass production of the 2-nanometer process, will handle the competition from these newer entrants is also of interest. Samsung Electronics aims to begin mass production of the 2-nanometer process next year.
An industry insider commented, "There is still a significant gap in technology reliability between Samsung and Rapidus, so a reversal is not imminent. However, Samsung needs to enhance its packaging technology, which has been lacking."
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