TSMC explores radical new chip packaging approach to feed AI boom – Nikkei Asia

Rectangular substrates to unlock more power are also being tested by Intel and Samsung
HSINCHU, Taiwan — Taiwan Semiconductor Manufacturing Co. is exploring a new method of advanced chip packing as the world’s biggest chipmaker races to keep pace with the AI-fueled demand for computing power.
TSMC is working with equipment and material suppliers on the new method, multiple people with direct knowledge of the matter told Nikkei Asia, though commercialization could take several years.
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