Tóm tắt bài báo kỹ thuật ngành công nghiệp chip: ngày 20 tháng 8

Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.

Replacing silicon and organic substrates requires huge shifts in manufacturing, creating challenges that will take years to iron out.

Softbank’s acquisition; advanced packaging funding; glass substrates; engineered copper wire; semi equipment set new record; HBM4; AI chips rake in funding; X-ray inspection; apprenticeships.

Samsung, Synopsys’ GAA processors; UMC’s 3D IC process; Si wafer shipments down; SiC wafer processing equipment up; women in CHIPS Act projects; imec startup fund; Infineon, ETAS auto security collab; quantum error correction; Intel’s cryogenic probing process.

TI’s CHIPS Act funding; security weaknesses in chip’s lifecycle; Huawei’s AI chip; TSMC’s Arizona funding; DOE’s IC energy efficiency; Eliyan’s funding; NIST PQC tools/standards; smarter fabs; power models; CPU performance bottlenecks.