Tóm tắt bài báo kỹ thuật ngành công nghiệp chip: ngày 14 tháng 10
New technical papers recently added to Semiconductor Engineering’s library:
Technical Paper | Research Organizations |
---|---|
Resolution enhancement for high-numerical aperture extreme ultraviolet lithography by split pupil exposures: a modeling perspective | Fraunhofer IISB and ASML |
Novel STI Technology for Enhancing Reliability of High-k/Metal Gate DRAM | Sungkyunkwan University and Samsung Electronics |
Flexible electronic-photonic 3D integration from ultrathin polymer chiplets | Dartmouth College and Boston University |
Rethinking Programmed I/O for Fast Devices, Cheap Cores, and Coherent Interconnects | ETH Zurich |
A Survey: Collaborative Hardware and Software Design in the Era of Large Language Models | Duke University and Johns Hopkins University |
Tunable multistate field-free switching and ratchet effect by spin-orbit torque in canted ferrimagnetic alloy | UC Berkeley and Lawrence Berkeley National Laboratory |
KeyVisor — A Lightweight ISA Extension for Protected Key Handles with CPU-enforced Usage Policies | CISPA Helmholtz Center for Information Security and Ruhr University Bochum |
More Reading
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The post Chip Industry Technical Paper Roundup: Oct. 14 appeared first on Semiconductor Engineering.
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