Tóm tắt bài báo kỹ thuật ngành công nghiệp chip: ngày 13 tháng 8

Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.

Replacing silicon and organic substrates requires huge shifts in manufacturing, creating challenges that will take years to iron out.

System design, large-scale simulations, and AI/ML could open multi-trillion-dollar markets for tools, methodologies, and services.

Softbank’s acquisition; advanced packaging funding; glass substrates; engineered copper wire; semi equipment set new record; HBM4; AI chips rake in funding; X-ray inspection; apprenticeships.