Tóm tắt bài báo kỹ thuật ngành công nghiệp chip: ngày 1 tháng 10

New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper	Research Organizations
Hardware Acceleration of Kolmogorov-Arnold Network (KAN) for Lightweight Edge Inference	Georgia Tech, TSMC and National Tsing Hua University.
Bendable non-silicon RISC-V microprocessor	Pragmatic Semiconductor, Qamcom, and Harvard University
Breakthrough low-latency, high-energy-efficiency LLM inference performance using NorthPole	IBM Research
Using both faces of polar semiconductor wafers for functional devices	Cornell University and Polish Academy of Sciences
Towards Fine-grained Partitioning of Low-level SRAM Caches for Emerging 3D-IC Designs	imec
Analogous Alignments: Digital “Formally” meets Analog	Infineon Technologies
VVTEAM: A Compact Behavioral Model for Volatile Memristors	Technion – Israel Institute of Technology
Characterizing the Broadband RF Permittivity of 3D-Integrated Layers in a Glass Wafer Stack from 100 MHz to 30 GHz	NIST