Teledyne e2v HiRel hợp tác với nhà phân phối Flip Electronics
News: Microelectronics
12 September 2024
Teledyne e2v HiRel Electronics of Milpitas, CA, USA (part of the Teledyne Defense Electronics Group that provides solutions, sub-systems and components to the space, transportation, defense and industrial markets) has partnered with distributor Flip Electronics of Alpharetta, Georgia, which will maintain inventories of its wafers for military applications, ensuring a consistent and reliable supply of critical components.
“Our semiconductor longevity programs provide a significant competitive advantage to our customers,” claims Mont Taylor, Teledyne e2v HiRel’s VP of business development. “Partnering with Flip Electronics allows us to offer a more resilient supply chain and respond swiftly to our customers’ needs and the evolving market conditions,” he adds.” This collaboration underscores our commitment to delivering high-quality, reliable solutions.”
Flip has secured the remaining quantity of WS57C291 WSI (Waferscale Integration Inc/STMicroelectronics) UV EPROM wafer inventory from Teledyne that are used to build multiple DLA-qualified Standard Microcircuit Drawing parts such as: 5962-87650 UV EPROM and 5962-88734 PROM.
The announcement “highlights Flip Electronics’ commitment to supporting our customers’ long-term capacity needs and maintaining their supply chain by providing, in some cases, obsolete parts,” says Flip’s CEO Jason Murphy. “This partnership will improve our ability to serve our customers and meet the rigorous requirements of military and space applications.”
The strategic partnership is said to strengthen the supply chain and mitigate the risks of obsolescence in high-reliability semiconductor devices, ensuring that both companies can continue to meet the critical demands of their military and space sector customers.
Teledyne e2v HiRel’s innovations lead developments in space, transportation, defense and industrial markets. Teledyne e2V HiRel’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully custom solutions, bringing increased value to their systems.
