STCO cho Kiến trúc Cạnh dày đặc sử dụng Tích hợp 3D và NVM (imec, et al.)

A new technical paper titled “System-Technology Co-Optimization for Dense Edge Architectures using 3D Integration and Non-Volatile Memory” was published by researchers at imec, INESC-ID, Université Libre de Bruxelles, et al.

Abstract:

“High-performance edge artificial intelligence (Edge-AI) inference applications aim for high energy efficiency, memory density and small form factor, requiring a design space exploration across the whole stack – workloads, architecture, mapping and co-optimization with emerging technology. In this paper, we present an system-technology co-optimization (STCO) framework that interfaces with workload-driven system scaling challenges and physical design-enabled technology offerings. The framework is built on three engines that provide the physical design characterization, dataflow mapping optimizer, and system efficiency predictor. The framework builds on a systolic array accelerator to provide the design-technology characterization points using advanced imec A10 nanosheet CMOS node along with emerging, high-density voltage-gated spin-orbit-torque (VGSOT) MRAM, combined with memory-on-logic fine-pitch 3D wafer-to-wafer hybrid bonding. We observe that 3D system integration of SRAM-based design leads to 9% power savings with 53% footprint reduction at iso-frequency w.r.t. 2D implementation for the same memory capacity. 3D NVM-VGSOT allows 4× memory capacity increase with 30% footprint reduction at iso-power compared to 2D SRAM 1×. Our exploration with two diverse workloads – image resolution enhancement (FSRCNN) and eye tracking (EDSNet) – shows that more resources allow better workload mapping possibilities which are able to compensate peak system energy efficiency degradation on high memory capacity cases. We show that a 25% peak efficiency reduction on a 32× memory capacity can lead to a 7.4× faster execution with 5.7× higher effective TOPS/W than the 1× memory capacity case on the same technology.”

Find the technical paper here (early access). November 2024.

L. M. Giacomini Rocha et al., “System-Technology Co-Optimization for Dense Edge Architectures using 3D Integration and Non-Volatile Memory,” in IEEE Journal on Exploratory Solid-State Computational Devices and Circuits, doi: 10.1109/JXCDC.2024.3496118.