ST hợp tác với Semikron để tích hợp công nghệ năng lượng SiC vào ổ đĩa EV

11 May 2022

STMicroelectronics of Geneva, Switzerland says it is supplying silicon carbide (SiC) technology for the eMPack electric vehicle (EV) power modules made by Semikron of Nuremberg, Germany.

This is the result of a four-year technical collaboration between the two companies to design-in ST’s SiC power semiconductors for superior efficiency and industry-benchmark performance in more compact systems. ST says that SiC is rapidly becoming the automotive industry’s preferred power technology for EV traction drives, contributing to greater driving range and reliability. Semikron recently announced that it had secured a billion-Euro contract to supply its eMPack power modules to a major German car maker, beginning in 2025.

“ST’s industry-leading SiC device-manufacturing capabilities and in-depth expertise with the technology enabled us to integrate these cutting-edge semiconductors with our advanced manufacturing processes, which enhance reliability, power density and scalability to meet the needs of the automotive industry,” comments Semikron’s chief executive officer & chief technical officer Karl-Heinz Gaubatz. “As we now move towards volume production, our collaboration with ST brings the assurance of a robust supply chain that gives control over quality and delivery performance,” he adds.

“Leveraging our SiC technology, Semikron’s advanced scalable eMPack family of power modules is ready to make a major contribution towards zero-emission motoring,” reckons Edoardo Merli, Power Transistor Sub-Group general manager & executive VP at STMicroelectronics. “In addition to its transformative effect in e-mobility, our SiC technology, now in its third generation, is driving increased efficiency, performance and reliability in sustainable energy and industrial power control applications.”

ST claims that its third-generation SiC technology delivers industry-leading process stability and performance. Engineers from ST and Semikron cooperated to integrate the STPOWER SiC MOSFETs, which control power switching in the main EV traction inverter, with Semikron’s fully sintered direct pressed die (DPD) assembly process. DPD enhances module performance and reliability and enables cost-effective power and voltage scaling. Leveraging the parameters of ST’s SiC MOSFETs, supplied as bare dice, Semikron has established 750V and 1200V eMPack platforms, addressing applications from 100kW to 750kW and battery systems from 400V to 800V.

ST has a broad portfolio of STPOWER SiC MOSFETs in production now. They are available in standard power packages or as bare dice that are optimal for advanced modules where high-power-density handling is a key requirement.

See related items:

ST launches third generation of STPOWER SiC MOSFETs

Tags: STMicroelectronics SiC power MOSFET

Visit: www.st.com

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