Samsung Announces SF2Z Chip Manufacturing Techology, New Solution For AI Products – Wccftech
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Taking stock of developments in AI, Korean technology giant Samsung announced a slew of new chip manufacturing technologies and other initiatives for the growing technology yesterday at its Samsung Foundry Forum in California. Along with TSMC and Intel, Samsung is the third firm in the world capable of making advanced semiconductors with the latest manufacturing technologies. At the forum, it introduced advanced variants of its 2-nanometer and 4-nanometer processes and stressed the importance of advanced transistor designs called gate all around (GAA) to the future of the chip industry.
At the center of Samsung’s latest event were the firm’s two new semiconductor manufacturing processes. These are the Samsung SF2Z and the Samsung SF4U processes. Among these, SF2Z is the leading edge node which is the third iteration of Samsung’s 2-nanometer processes called Samsung SF2. With SF2Z, the firm is joining other chip manufacturers, such as Intel and TSMC, to optimize power delivery to its chips.
Samsung, like others, will enable its chips to receive power through the ‘backside’ of the wafer. This region has lower resistance, and according to Samsung, backside power delivery network (BSPDN) improves a chip’s power, performance and area (PPA) and ensures that it has a steady voltage, which is crucial for high performance computing applications.
BSPDN is not a new concept in the industry, and some of the first rumors of the technology surfaced a year back in April. These saw Taiwanese supply chain sources claim that Samsung’s larger rival TSMC would use BSPDN for an advanced variant of its 2-nanometer process called N2P. However, TSMC confirmed earlier this year that while the N2P would not feature BSPDN, its next generation chip manufacturing process dubbed A16 will.
Samsung’s second new process technology, SF4U, incorporates a shrunk variant of earlier designs. Chip manufacturers dub this an ‘optical shrink,’ and it involves reducing the die’s area through photographic measures.
Samsung also shared details for its next generation chip manufacturing process called SF1.4. SF1.4 is on track for mass production in 2027, and it is also set to meet yield and performance targets according to the chip maker. The firm added that it will kick off mass production of its second generation 3-nanometer process technologies in the second half of this year.
Tackling the expected impact of AI on the semiconductor industry, Samsung also announced an off the shelf chip manufacturing service called Samsung AI Solutions. The firm shared that Samsung AI Solutions will combine the firm’s foundry, memory and packaging divisions to offer a ‘turnkey’ platform that allows customers to reduce development times and design custom chips.
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