OIF ra mắt sách trắng dự án khung CEI-224G cho các hệ thống tốc độ dữ liệu thế hệ tiếp theo
News: Optoelectronics
15 February 2022
As the industry looks forward to higher data rates and increased throughput for the next generation of systems based on 224Gbps per lane, new specifications and technologies will be required. The Optical Internetworking Forum (OIF) has announced a framework document representing its efforts to identify the hardware interconnection application spaces where the communications and computer industries could benefit from interconnection definitions or Implementation Agreements (IA).
The CEI-224G framework project has resulted in a white paper summarizing the consensus findings and guidance for new OIF project starts for future CEI clauses addressing specific 224Gbps reaches and architectures. Further, it identifies key technical challenges for next-generation systems, defines electrical interconnection applications, and discusses some of the interoperability test challenges. This provides the OIF and other industry standards bodies with a common language and understanding of the development projects required for next-generation data-rate systems. It also establishes baseline materials that will enable 1.6/3.2Tbps-rate architectures and lower-cost, lower-complexity 800Gbps and 400Gbps architectures.
“As demonstrated in the past, most recently at 112Gbps, OIF plays a key role in driving industry activity to identify and develop critical technical solutions that will enable next-generation data rates to be cost-effectively deployed in future equipment and networks,” says OIF president’s Cathy Liu of Broadcom Inc.
Service providers, network customers and data-center operators have communicated that higher data rates like 224Gbps are required for client- and line-side links to support higher volumes of traffic on the core and backbone networks. These next-generation data rates need to be implemented while also addressing power consumption, density, performance, reach and cost challenges.
“224Gbps is going to bring many difficult challenges for the industry to address to achieve practical implementations in an interoperable way,” says OIF’s VP of marketing Nathan Tracy of TE Connectivity. “This framework project and its resultant white paper align OIF members and industry on many of the key hurdles,” he adds. “Overcoming obstacles can be achieved by having consensus amongst a broad cross-section of component, subsystem and system suppliers to leverage new technologies that drive signaling, architecture and integration developments.”
