Manz AG Showcases its Panel-Level Semiconductor Packaging Technology at SEMICON Southeast Asia 2024 at MITEC – The Edge Malaysia
(29 May, Kuala Lumpur) The ongoing SEMICON Southeast Asia 2024 at MITEC (Malaysia International Trade and Exhibition Centre) is the largest congregation of supply chain companies in the semiconductor and electronics industry and is scheduled to run from the 28th to 30th of May 2024. Germany based Manz AG, a key player in the industrial supply chain, showcased some of the company’s key technologies during the exhibition.
The semiconductor and electronics industry has been one of the world’s most important industries in the modern age as many of the downstream products form the underpinning of our modern, technologically driven society. Malaysia has a strong track record in the industry and is poised to tap into this wave to further its development in the field.
According to Robert Lin, General Manager of Manz Asia, the company latest Redistribution Layer (RDL) process equipment offers numerous advantages for fabricators and integrated design manufacturers. Manz’s panel-level packaging RDL production solution can help manufacturers achieve high-density chip packaging for greater efficiency.
Lin added that Manz has been able to tap into more than 40 years of experience in lithography, electroplating and printed-circuit board (PCB) to bridge the needs of producers in matching integrated circuits to PCB for a wide range of applications.
Of interest is the company’s Fan-Out Panel Level Packaging (FOPLP) technology featured during the exhibition that promises to meet the stringent requirements of manufacturers. The industry has been shifting towards glass substrates as an alternative to silicon wafer to take advantage of the greater heat tolerance and rigidity of glass to further expand throughput over traditional silicon wafer production.
Glass substrate allows for tighter tolerance, less waste and higher density production, but also requires greater degree of accuracy from production equipment, and this is where Manz’s FOPLP technology delivers on its core promises over competing products.
Manz’s other key technology is its vertical plating technology that allows for electroplating without the use of a jig. This system removes the need for expensive jig and allows for faster design iteration. This technology also does away with the electroplating and cleaning solution used in traditional plating techniques which significantly reduce the waste that goes a long way towards helping companies meet their environmental goals while improving their production capabilities.
The modular electroplating equipment offers tremendous degree of flexibility for configuration according to customer’s production requirement and production line design. The components are simple to operate, easy to maintain and can be scaled up or down according to the changing needs of customers.
Lin stressed that Malaysia and Singapore are key target markets for the Manz in its Southeast Asian operation, and the company is already supporting many existing clients and equipment providers through its service office in Malaysia. He added that through its global presence, Manz is close to the pulse of the semiconductor and electronics industry and can provide manufacturers with leading edge technology and know-hows to better prepare them in this highly competitive market.
The company is looking to expand its scope in Malaysia by setting up training centres for its support staff as well as customers to further add value to its offering. Manz will continue to grow its customer base and should critical mass be reached, will look into the potential of setting up manufacturing site for the company’s products in Malaysia in the future.
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