Infineon ra mắt mô-đun nguồn HybridPACK Drive G2 Fusion
News: Microelectronics
15 October 2024
Infineon launches HybridPACK Drive G2 Fusion power module
To make electric mobility accessible to a broader market by combining affordability with high performance and efficiency, Infineon Technologies AG of Munich, Germany is introducing the HybridPACK Drive G2 Fusion, establishing a new power module standard for traction inverters in the e-mobility sector. The HybridPACK Drive G2 Fusion is the first plug’n’play power module that implements a combination of Infineon’s silicon and silicon carbide (SiC) technologies. This provides a balance between performance and cost efficiency, giving more choice in the optimization of inverters.
One of the main differences between silicon and SiC in power modules is that SiC has a higher thermal conductivity, breakdown voltage and switching speed, making it more efficient but also more expensive than silicon-based power modules. With the new module, the SiC content per vehicle can be reduced, while maintaining vehicle performance and efficiency at a lower system cost. For example, system suppliers can realize nearly the system efficiency of a full-SiC solution with only 30% SiC and 70% silicon area.
“Addressing the demand for greater e-mobility range, this technological breakthrough smartly combines silicon carbide and silicon,” says Negar Soufi-Amlashi, senior VP & general manager High Voltage at Infineon’s Automotive division. “Integrated in a well-introduced module package footprint, it offers compelling cost-performance ratio over pure silicon carbide modules without adding system complexity for automotive system suppliers and vehicle manufacturers.”
HybridPACK Drive G2 Fusion expands Infineon’s HybridPACK Drive power module portfolio and can be quickly and easily integrated in vehicle components or modules without requiring complex adjustments or configurations. The HybridPACK Drive G2 Fusion module features up to 220kW in the 750V class. It ensures high reliability over the entire temperature range from –40°C to +175°C and improved thermal conductivity. The unique properties of Infineon’s CoolSiC technology and its silicon IGBT EDT3 technology with very fast turn-on enable the use of a single gate driver or dual gate drivers. This allows easy re-design from full-silicon- or full-SiC-based inverters to a fusion inverter. Infineon says that, generally, its holistic expertise in SiC MOSFET and silicon IGBT technology, power module packaging, gate drivers as well as sensors enables premium products with cost savings at the system level. One example is the integration of Swoboda or XENSIV Hall sensors in the HybridPACK Drive package for more precise and efficient motor control.
Infineon is showcasing the new HybridPACK Drive G2 Fusion in booth 502 (hall C3) at electronica 2024 in Munich (12–15 November).
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