Hiệu suất kiến trúc ban đầu và phân tích công suất của thiết kế nhiều khuôn

Despite the clear advantages of multi-die designs, there are numerous new challenges that stand in the way of multi-die design realization. This white paper focuses on those challenges that can be addressed by early architecture exploration of multi-die designs, including:

-System pathfinding
-Memory utilization and coherency
-Power/thermal management

Find out how to overcome such challenges with a standards-based performance and power analysis tool for early architecture exploration of multi-die designs. It accounts for the interdependencies between multiple dies (also referred to as chiplets) within multi-die systems.

Read more here.