TMSC begins publicly mentioning 1.4-nanometer fabrication for next-gen Apple products – O'Grady's Power Page
If you think a three-nanometer fabrication process is small and power-efficient, chip manufacturer TSMC has publicly commented on its work on a 1.4nm fabrication technology that is likely destined to underpin future Apple silicon chips.
In a slide (via SemiAnalysis’s Dylan Patel) from its Future of Logic panel, TSMC disclosed the official name of its 1.4nm node for the first time, “A14.” The company’s 1.4nm technology is expected to follow its “N2” 2nm chips.
The N2 chips are scheduled for mass production in late 2015, and will be followed by an enhanced “N2P” node in late 2026.
Apple was the first company to utilize TSMC’s 3nm technology with the A17 Pro chip in the iPhone 15 Pro and iPhone 15 Pro Max, and the company is likely to follow suit with the chipmaker’s upcoming nodes. Apple’s latest chip technology has historically appeared in the iPhone before making its way to the iPad and Mac lineups.
With all of the latest information, here’s how the iPhone’s chip technology could look going forward:
The M1 series of Apple Silicon chips was based off the A14 Bionic and TSMC’s N5 node, while the M2 and M3 series use N5P and N3B, respectively. The Apple Watch’s S4 and S5 chips use N7, the S6, S7, and S8 chips use N7P, and the latest S9 chip uses N4P.
The successive generations surpass the predecessor in terms of transistor density, performance, and efficiency. Earlier this week, it emerged that TSMC had already demonstrated prototype 2nm chips to Apple ahead of their expected introduction in 2025.
Stay tuned for additional details as they become available.
Via MacRumors and @dylan522p
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