CEA-Leti Annual Gathering to Highlight Microelectronics and Global Investment Surge – TimesTech
With the global semiconductor industry gearing up to meet the huge anticipated growth in demand for miniaturized, more resource-efficient electronics for multiple applications, CEA-Leti will present its most recent innovations and breakthroughs to help meet that demand at Leti Innovation Days, June 25-27 in Grenoble.
Leti Innovation Days 2024 will offer more than 1,000 semiconductor industry professionals a close-up look at new microelectronic solutions that will help power, control and enable ultra-sophisticated devices and equipment across the industrial, medical, automotive and consumer markets.
“CEA-Leti is committed to getting new semiconductor technologies from lab to fab swiftly and efficiently,” said CEA-Leti CEO Sébastien Dauvé. “We invest extensively in our pilot lines each year and, as chip production ramps up around the globe, this year presents unprecedented opportunities for CEOs, research & development directors, engineers and visionaries to innovate and deliver.”
Presentations, workshops and discussions will cover many timely and critical topics for the industry, ranging from AI, edge computing, augmented reality and green technologies to health care, telecommunications and optics.
“As always at CEA-Leti, partnerships will be instrumental to helping industry leaders and innovators accelerate their progress from lab to fab with relevant, robust and reliable products for their key markets,” said Michael Tchagaspanian, CEA-Leti EVP strategic partnerships & event chairman.
Speak with CEA-Leti’s partners from the entire semiconductor value chain:
With dozens of semiconductor companies from around the world represented, Leti Innovation Days is where CEOs and CTOs come to meet. Targeted business meetings are the ideal way to find your next technology partner or provider.
Soitec, Schneider Electric, Siemens, Equans, Le Groupe BBM, BM&A, KELTEN, Weebit Nano, Global Foundries, SCREEN, Intel Foundry, ASML, Synopsys, EBARA, TEL, PREVAIL, NY CREATES, STMicroelectronics, AIXTRON, Electronmec, EVG, LAM Research, Entegris, Pfeiffer Vacuum, Banque Populaire Auvergne Rhône Alpes, Technic, Veeco, Edwards, ASM, Applied Materials, Lynred, Thermo Fisher, and with support from Auvergne Rhône-Alps Region, Carnot Institutes network, Grenoble Alpes Métropole and SEMI.
EE Times Europe, EE News Europe, Microwave Journal, Silicon Semiconductor, Compound Semiconductor, Times Tech, SemiWiki, Pradeep’s Techpoints and Yole Group.